During the course of using the metal dome array, will the dust get in? This has something to do with the assembly method of metal domes.
For instance, the triangle metal dome with the legs is usually fixed with the two legs on the PCB. During the course, dust easily enters the surface of the PAD through the two slots on the PCB, causing poor conduction.
If it is not properly designed, dust will be easy to enter. For instance, the metal dome is too close to the edge, and the metal dome is easy to put the PET up. During the pressing course, the dust is easy to enter the surface on the PAD of PCB and cause poor conduction.
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